EmsiTech >>
Electronic Manufacturing
Up to 45000 components per hour.
Up to 18000 components per hour.
Automatic optical inspection equipment.
Up to 45000 components per hour.
SMT Production
Our partner factory counts with three complete Surface Mount Technology (SMT) production lines. The production capabilities are:
>> Stencil size: Up to 736 x 736mm.
>> PCB size: 50x50mm to 390x420mm.
>> PCB Thickness: 0.4 to 3mm.
>> Pitch: 0.28mm for QFPand 0.3mm for BGA.
>> Size: 0201 to QFP 44mm.
>> Pitch: 0.28mm for QFPand 0.3mm for BGA.
>> Tolerance: +/-0.03mm for QFP and BGA.
Also, the following inspection equipment is available:
>> Automatic Optical Inspection (AOI).
>> X-Ray (BGA assembly quality inspection).
Semi-automatic DIP soldering line.
Semi-automatic DIP soldering line.
THT & DIP
For through hole components (THT), the following production lines are available:
>> One Wave Soldering (DIP) line.
>> One Hand Soldering line.
Quality control and rework stations to assure the quality of your product.
Clean room class 10000 assembly line available for special applications.
Quality control and rework stations to assure the quality of your product.
Testing & Assembly
After the electronic boards are completed, the factory counts with several testing and rework stations to assure the quality of the product.
To deliver a complete product, there is also the following production faciilies:
>> Two standard assembly lines.
>> One clean room assembly line (Class 10000).
The standard lines are used for housing assembly and packaging. The clean room assembly line is used for special processes that demand extremely good air quality at the moment of assembly. LCD bonding and medical products are some of the applications that need this kind of space.